PCB Fabrication
Magnum enjoys over 15 years of reputation as a PCB supplier of high quality standards and competitive pricing. We are qualified and experienced to use standard FR-4, high Tg, halogen free and high speed/ultra low loss materials. Our clientèle extends to medical, gaming, telecommunication and industrial electronics.
Range of PCBs
- Double sided PCBs
- Multilayer up to 16 layers
- RoHS compliant (Tg>170°C) PCBs
- High Density Interconnect PCBs
- Flexible
- Rigid-flex PCBs
Specialization
- Advanced high layer line card
- High performance standard/mid/low loss and Green materials
- Advanced registration system for tight D2M design
- Sequential build up
- N+N, N+M+N structure
- Sequential line card technology for high speed application
- High layer backplane
- Backplane board size up to 40″x20″
- Provider for Telecom
- HDI line card
- Large format System HDI board
Value Added Services through Product Life Cycle
- R&D
- Design for manufacturing
- Material selection
- Panelization
- Optimization
- New Product Introduction (NPI)
- Prototyping
- Pilot testing
- Technical support on issues emerging from prototyping
- Production
- Cost-effective solution
- Reduced lead time
- Price reduction
- Maturity
- High volume
- Improve yield and further cost reduction
PCB Product Overview
Materials
Type of Lamination | Model | Type of Lamination | Model |
Normal Tg | SYL S1141 MICA EG 150T PANASONIC R1755C | High Tg w/ Filler | SYL S1000-2 MICA HR-02 PANASONIC R1755V NELCO N4000-29 |
Middle Tg | SYL S1141KF SYL S1000 MICA LA-02 | Mid/Low Loss | ISOLA FR408, FR408HR NELCO N4000-13, 13SI, 13 EP MITSUBISHI EL-190T HITACHI MCL-HE-679G |
Halogen Free | SYL S1155 R-1566W, WN, V NPGN 150, 170 | Ultra Low Loss | ROGER 4350/4000 PANASONIC MEGTRON 6 |
High Tg | SYL S1170 MICA HR-01 PANASONIC R1755V | PTFE | TACONIC RF-35A2 |
Production Capabilities
Elements | Capability | Elements | Capability |
Max. circuitry width | 564mm | Base copper weight (Inner layer) | 1/3oz – 4oz |
Max. circuitry length | 1021mm | Base copper weight (Outer layer) | 1/4oz – 3oz |
Max. layer count | 20 | Press-fit hole size tolerance | ± 0.05mm |
Max. board thickness | 8mm | Aspect ratio (Line card) | 15:1 |
Max. board thickness tolerance | ± 8% | Aspect ratio (Back panel) | 16:1 |
Routing outline tolerance | ± 10mm | Type of Finishes | |
Impedance ≤ 50Ω | +/- 8% | Single Surface Finishes | ENIG (Autotech CNN/ NPR-8) Electrolytic Nickel Gold Plating Immersion Tin (Stanntech) Immersion Silver (Sterling) OSP (Entek Plus HT), HASL |
Min. inner trace spacing (Line card) | 0.075/0.075mm | Dual Surface Finishes | ENIG (Autotech CNN) + OSP Tab gold (G/F) + I-Silver Tab gold (G/F) + HASL Tab gold (G/F) + OSP |
Production Lead Time
| Lead Time (Days) | |||
| Layer | Standard Protos | Express Protos | Mass Production |
| 2 | 5 | 3 | 10 |
| 4 | 6 | 3 | 14-21 |
| 6 | 7 | 4 | 18-21 |
| 8 | 8 | 5 | 21-24 |
| 10 | 10 | 6 | 23-26 |
| 12 and above | 12 | 6 | From 30 |
*The above lead times excludes transit time to destination
Reliability Testing & Analysis
Testing Equipment:
- SIR tester
- Hi Pot tester
- Wet force balance
- Temp cycling chamber
- SPP testing
- Akrometrix 3D flatness tester
- ATC chamber
- LCR tester
- HAST
- Thermograph
- RoHS tester
- IST tester
- TMA tester
- Ionic contamination chamber
Analysis Equipment:
- IR reflow
- Wave soldering
- SEM & EDX
Industries Served
Industries Served
We serve the following industrial sectors:
- Medical
- Telecommunication
- Gaming
- Industrial electronics
Certification
